Zithunzi za SemiceraKaseti Waferndi gawo lofunikira kwambiri pakupanga kwa semiconductor, lopangidwa kuti lizigwira motetezeka ndikunyamula zowotcha za semiconductor. TheKaseti Waferimapereka chitetezo chapadera, kuwonetsetsa kuti chowotcha chilichonse chimakhala chopanda zodetsa komanso kuwonongeka kwakuthupi panthawi yogwira, kusungirako, ndi poyendetsa.
Yopangidwa ndi zinthu zoyera kwambiri, zosagwirizana ndi mankhwala, SemiceraKaseti Waferzimatsimikizira ukhondo wapamwamba kwambiri ndi kulimba, zofunikira kuti ziwombankhanga zikhale zowongoka pagawo lililonse la kupanga. Kukonzekera kolondola kwa makasetiwa kumalola kusakanikirana kosasunthika ndi makina ogwiritsira ntchito makina, kuchepetsa chiopsezo cha kuipitsidwa ndi kuwonongeka kwa makina.
Mapangidwe aKaseti Waferimathandizanso kuyendetsa bwino kwa mpweya ndi kutentha, zomwe ndizofunikira kwambiri pazochitika zomwe zimafuna kuti chilengedwe chikhale chokhazikika. Kaya amagwiritsidwa ntchito m'zipinda zoyeretsa kapena panthawi yotentha, SemiceraKaseti Waferidapangidwa kuti ikwaniritse zofunikira zamakampani opanga ma semiconductor, ndikupereka magwiridwe antchito odalirika komanso osasinthika kuti apititse patsogolo kupanga bwino komanso mtundu wazinthu.
| Zinthu | Kupanga | Kafukufuku | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Kulakwitsa koyang'ana pamwamba | <11-20>4±0.15° | ||
| Magetsi Parameters | |||
| Dopant | n-mtundu wa Nayitrogeni | ||
| Kukaniza | 0.015-0.025ohm · masentimita | ||
| Mechanical Parameters | |||
| Diameter | 150.0 ± 0.2mm | ||
| Makulidwe | 350±25 μm | ||
| Choyambira chapansi pamayendedwe | [1-100] ± 5° | ||
| Kutalika kosalala koyambirira | 47.5 ± 1.5mm | ||
| Sekondale flat | Palibe | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Kugwada | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Kapangidwe | |||
| Kuchuluka kwa Micropipe | <1 pa/cm2 | <10 pa/cm2 | <15 pa/cm2 |
| Zitsulo zonyansa | ≤5E10 maatomu/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 pa/cm2 | ≤1000 ea/cm2 | NA |
| Front Quality | |||
| Patsogolo | Si | ||
| Kumaliza pamwamba | Si-nkhope CMP | ||
| Tinthu ting'onoting'ono | ≤60ea/wafer (kukula ≥0.3μm) | NA | |
| Zikanda | ≤5ea/mm. Kutalika kwake ≤Diameter | Kutalika kokwanira≤2 * Diameter | NA |
| Peel/maenje/madontho/mikwingwirima/ ming'alu/kuipitsidwa | Palibe | NA | |
| M'mphepete tchipisi / indents / fracture / hex mbale | Palibe | ||
| Zigawo za polytype | Palibe | Malo owonjezera≤20% | Malo owonjezera ≤30% |
| Chizindikiro cha laser chakutsogolo | Palibe | ||
| Back Quality | |||
| Kumbuyo komaliza | C-nkhope CMP | ||
| Zikanda | ≤5ea/mm,Cumulative kutalika≤2*Diameter | NA | |
| Zowonongeka zam'mbuyo (zolowera m'mphepete / ma indents) | Palibe | ||
| Msana roughness | Ra≤0.2nm (5μm*5μm) | ||
| Chizindikiro cha laser kumbuyo | 1 mm (kuchokera m'mphepete) | ||
| M'mphepete | |||
| M'mphepete | Chamfer | ||
| Kupaka | |||
| Kupaka | Epi-okonzeka ndi zoyika vacuum Kupaka makaseti amitundu yambiri | ||
| *Zindikirani: "NA" zikutanthauza kuti palibe pempho Zinthu zomwe sizinatchulidwe zingatanthauze SEMI-STD. | |||
