Semicera's SOI Wafer (Silicon On Insulator) idapangidwa kuti izipereka kudzipatula kwamagetsi kwapamwamba komanso magwiridwe antchito amafuta. Kapangidwe kake kakang'ono kameneka, kokhala ndi silicon wosanjikiza pa insulating layer, kumapangitsa kuti chipangizocho chizigwira ntchito bwino komanso kuti chichepetse kugwiritsa ntchito mphamvu, zomwe zimapangitsa kuti zikhale zoyenera kugwiritsa ntchito zida zapamwamba zambiri.
Zowotcha zathu za SOI zimapereka phindu lapadera pamabwalo ophatikizika pochepetsa mphamvu ya parasitic ndikuwongolera liwiro la chipangizocho komanso kuchita bwino. Izi ndizofunikira kwambiri pamagetsi amakono, pomwe magwiridwe antchito apamwamba komanso mphamvu zamagetsi ndizofunikira kwa ogwiritsa ntchito komanso mafakitale.
Semicera imagwiritsa ntchito njira zopangira zapamwamba kuti apange zowotcha za SOI zokhazikika komanso zodalirika. Zophika izi zimapereka mpweya wabwino kwambiri wamafuta, zomwe zimawapangitsa kukhala oyenera kugwiritsidwa ntchito m'malo momwe kutentha kumadetsa nkhawa, monga pazida zamagetsi zolimba kwambiri komanso makina owongolera mphamvu.
Kugwiritsa ntchito zowotcha za SOI popanga semiconductor kumapangitsa kuti pakhale tchipisi tating'ono, mwachangu, komanso zodalirika. Kudzipereka kwa Semicera pakupanga uinjiniya wolondola kumawonetsetsa kuti zowotcha zathu za SOI zikukwaniritsa miyezo yapamwamba yofunikira paukadaulo wamakono m'magawo monga matelefoni, magalimoto, ndi zamagetsi zamagetsi.
Kusankha Semicera's SOI Wafer kumatanthauza kuyika ndalama muzinthu zomwe zimathandizira kupita patsogolo kwaukadaulo wamagetsi ndi ma microelectronic. Zophika zathu zidapangidwa kuti zizipereka magwiridwe antchito komanso kulimba, zomwe zimathandizira kuti mapulojekiti anu apamwamba apite patsogolo ndikuwonetsetsa kuti mumakhala patsogolo pazatsopano.
| Zinthu | Kupanga | Kafukufuku | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Kulakwitsa koyang'ana pamwamba | <11-20>4±0.15° | ||
| Magetsi Parameters | |||
| Dopant | n-mtundu wa Nayitrogeni | ||
| Kukaniza | 0.015-0.025ohm · masentimita | ||
| Mechanical Parameters | |||
| Diameter | 150.0 ± 0.2mm | ||
| Makulidwe | 350±25 μm | ||
| Choyambira chapansi pamayendedwe | [1-100] ± 5° | ||
| Kutalika kosalala koyambirira | 47.5 ± 1.5mm | ||
| Sekondale flat | Palibe | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Kugwada | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Kapangidwe | |||
| Kuchuluka kwa Micropipe | <1 pa/cm2 | <10 pa/cm2 | <15 pa/cm2 |
| Zitsulo zonyansa | ≤5E10 maatomu/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 pa/cm2 | ≤1000 ea/cm2 | NA |
| Front Quality | |||
| Patsogolo | Si | ||
| Kumaliza pamwamba | Si-nkhope CMP | ||
| Tinthu ting'onoting'ono | ≤60ea/wafer (kukula ≥0.3μm) | NA | |
| Zikanda | ≤5ea/mm. Kutalika kwake ≤Diameter | Kutalika kokwanira≤2 * Diameter | NA |
| Peel/maenje/madontho/mikwingwirima/ ming'alu/kuipitsidwa | Palibe | NA | |
| M'mphepete tchipisi / indents / fracture / hex mbale | Palibe | ||
| Zigawo za polytype | Palibe | Malo owonjezera≤20% | Malo owonjezera ≤30% |
| Chizindikiro cha laser chakutsogolo | Palibe | ||
| Back Quality | |||
| Kumbuyo komaliza | C-nkhope CMP | ||
| Zikanda | ≤5ea/mm,Cumulative kutalika≤2*Diameter | NA | |
| Zowonongeka zam'mbuyo (zolowera m'mphepete / ma indents) | Palibe | ||
| Msana roughness | Ra≤0.2nm (5μm*5μm) | ||
| Chizindikiro cha laser kumbuyo | 1 mm (kuchokera m'mphepete) | ||
| M'mphepete | |||
| M'mphepete | Chamfer | ||
| Kupaka | |||
| Kupaka | Epi-okonzeka ndi zoyika vacuum Kupaka makaseti amitundu yambiri | ||
| *Zindikirani: "NA" zikutanthauza kuti palibe pempho Zinthu zomwe sizinatchulidwe zingatanthauze SEMI-STD. | |||
