Njira Yopangira Semiconductor - Etch Technology

Mazana a njira amafunika kutembenuza amtandamu semiconductor. Chimodzi mwazinthu zofunika kwambiri ndietching- ndiye kuti, kujambula mawonekedwe abwino ozungulira pamtanda. Kupambana kwaetchingndondomeko zimatengera kuyang'anira zosinthika zosiyanasiyana mkati mwa magawo ogawa, ndipo chida chilichonse cholumikizira chiyenera kukonzedwa kuti chizigwira ntchito bwino. Akatswiri athu opanga ma etching amagwiritsa ntchito ukadaulo wapamwamba kwambiri wopanga kuti amalize mwatsatanetsatane izi.
SK Hynix News Center idafunsa mamembala a Icheon DRAM Front Etch, Middle Etch, ndi End Etch technical team kuti adziwe zambiri za ntchito yawo.
Etch: Ulendo Wopititsa Patsogolo Pachitukuko
Popanga semiconductor, etching imatanthawuza zojambula pamakanema owonda. Zitsanzo zimapopera pogwiritsa ntchito plasma kuti apange ndondomeko yomaliza ya sitepe iliyonse. Cholinga chake chachikulu ndikuwonetsetsa bwino machitidwe olondola molingana ndi makonzedwe ake ndikusunga zotsatira zofananira pansi pamikhalidwe yonse.
Ngati mavuto achitika pakuyika kapena kujambula zithunzi, amatha kuthetsedwa ndi ukadaulo wosankha (Etch). Komabe, ngati china chake sichikuyenda bwino panthawi ya etching, vutoli silingasinthidwe. Izi zili choncho chifukwa zinthu zomwezo sizingadzazidwe m'malo olembedwapo. Chifukwa chake, popanga semiconductor, etching ndiyofunikira kuti muwone zokolola zonse ndi mtundu wazinthu.

Njira etching imaphatikizapo masitepe asanu ndi atatu: ISO, BG, BLC, GBL, SNC, M0, SN ndi MLM.
Choyamba, siteji ya ISO (Isolation) etches (Etch) silikoni (Si) pa kabati kuti apange gawo logwira ntchito. Gawo la BG (Buried Gate) limapanga mzere wa adilesi (Mzere wa Mawu) 1 ndi chipata chopanga njira yamagetsi. Kenako, gawo la BLC (Bit Line Contact) limapanga kulumikizana pakati pa ISO ndi mzere wa adilesi (Bit Line) 2 m'dera la cell. Gawo la GBL (Peri Gate + Cell Bit Line) nthawi yomweyo lipanga mzere wa adilesi ya cell ndi chipata chozungulira 3.
Gawo la SNC (Storage Node Contract) likupitiriza kupanga mgwirizano pakati pa malo ogwira ntchito ndi malo osungiramo 4. Pambuyo pake, gawo la M0 (Metal0) limapanga malo ogwirizanitsa a S / D (Storage Node) 5 ndi malo olumikizirana. pakati pa mzere wa adilesi ndi malo osungira. Gawo la SN (Storage Node) limatsimikizira kuchuluka kwa unit, ndipo gawo lotsatira la MLM (Multi Layer Metal) limapanga magetsi akunja ndi mawaya amkati, ndipo njira yonse yopangira etching (Etch) yatha.

Popeza kuti akatswiri a etching (Etch) ndiwo makamaka omwe ali ndi udindo wopanga ma semiconductors, dipatimenti ya DRAM imagawidwa m'magulu atatu: Front Etch (ISO, BG, BLC); Middle Etch (GBL, SNC, M0); End Etch (SN, MLM). Maguluwa amagawidwanso molingana ndi malo opangira zinthu komanso malo opangira zida.
Maudindo opanga ali ndi udindo woyang'anira ndikuwongolera njira zopangira ma unit. Maudindo opanga amatenga gawo lofunikira kwambiri pakuwongolera zokolola ndi mtundu wazinthu kudzera muulamuliro wosinthika ndi njira zina zokometsera zopanga.
Malo opangira zida ali ndi udindo woyang'anira ndi kulimbikitsa zida zopangira kuti apewe zovuta zomwe zingachitike panthawi yolemba. Udindo waukulu wa malo a zida ndikuwonetsetsa kuti zida zikuyenda bwino.
Ngakhale kuti maudindo ali omveka bwino, magulu onse amagwira ntchito kuti akwaniritse cholinga chimodzi - ndiko kuti, kuyang'anira ndi kukonza njira zopangira ndi zipangizo zogwirizana kuti zitheke. Kuti izi zitheke, gulu lililonse limagawana zomwe akwaniritsa komanso madera omwe akufuna kukonza, ndikuthandizana kuti bizinesiyo iyende bwino.
Momwe mungathanirane ndi zovuta zaukadaulo wa miniaturization

SK Hynix idayamba kupanga zinthu zambiri za 8Gb LPDDR4 DRAM zamakalasi a 10nm (1a) mu Julayi 2021.

Miyezo ya semiconductor memory circuit yalowa mu nthawi ya 10nm, ndipo pambuyo pakusintha, DRAM imodzi imatha kukhala ndi maselo pafupifupi 10,000. Choncho, ngakhale mu etching ndondomeko, ndondomeko malire sikokwanira.
Ngati dzenje lopangidwa (Hole) 6 ndi laling'ono kwambiri, likhoza kuwoneka "losatsegulidwa" ndikuletsa gawo lapansi la chip. Kuphatikiza apo, ngati dzenje lopangidwa ndi lalikulu kwambiri, "kutsekereza" kungachitike. Pamene kusiyana pakati pa mabowo awiri sikukwanira, "kutsekereza" kumachitika, zomwe zimapangitsa kuti pakhale mavuto ophatikizana pamasitepe otsatirawa. Pamene ma semiconductors akuchulukirachulukira, kuchuluka kwa kukula kwa dzenje kumachepa pang'onopang'ono, ndipo zoopsazi zidzathetsedwa pang'onopang'ono.
Kuti athetse mavuto omwe ali pamwambawa, akatswiri a zamakono a etching akupitiriza kukonza ndondomekoyi, kuphatikizapo kusintha ndondomeko ya ndondomeko ndi APC7 aligorivimu, ndikuyambitsa umisiri watsopano wa etching monga ADCC8 ndi LSR9.
Pamene zosowa zamakasitomala zimasiyanasiyana, vuto lina labuka - chizolowezi chopanga zinthu zambiri. Kuti tikwaniritse zosowa zamakasitomala zotere, njira zokometsedwa za chinthu chilichonse ziyenera kukhazikitsidwa padera. Ili ndi vuto lapadera kwambiri kwa mainjiniya chifukwa amayenera kupanga ukadaulo wopanga zinthu zambiri kuti ukwaniritse zosowa zazomwe zakhazikitsidwa komanso zosiyanasiyana.
Kuti izi zitheke, akatswiri a Etch adayambitsa ukadaulo wa "APC offset"10 kuti azitha kuyang'anira zotumphukira zosiyanasiyana kutengera zinthu zazikuluzikulu (Core Products), ndikukhazikitsa ndikugwiritsa ntchito "T-index system" kuyang'anira bwino zinthu zosiyanasiyana. Kupyolera mu zoyesayesazi, dongosololi lakhala likukonzedwa mosalekeza kuti likwaniritse zosowa za kupanga zinthu zambiri.