Kuphunzira pa semiconductor kufakugwirizana ndondomeko, Kuphatikizira njira zomata zomatira, njira yolumikizira eutectic, njira yolumikizira yofewa, yolumikizira siliva, njira yolumikizira yotentha, njira yolumikizira chip chip. Mitundu ndi zizindikiro zofunika zaukadaulo za zida za semiconductor die bonding zimayambitsidwa, momwe chitukuko chimawunikidwa, ndipo momwe chitukuko chikuyembekezeka.
1 Chidule chamakampani a semiconductor ndi ma CD
Makampani opanga ma semiconductor makamaka amaphatikiza zida ndi zida zam'mwamba za semiconductor, kupanga ma semiconductor apakati, ndikugwiritsa ntchito pansi. dziko langa makampani opangira zida zopangira zida zamagetsi adayamba mochedwa, koma patatha zaka pafupifupi khumi zachitukuko chofulumira, dziko langa lakhala msika waukulu kwambiri padziko lonse lapansi wogulitsira zinthu za semiconductor komanso msika waukulu kwambiri padziko lonse lapansi wa zida zama semiconductor. Makampani opanga ma semiconductor akukula mwachangu mum'badwo umodzi wa zida, m'badwo umodzi wazinthu, komanso m'badwo umodzi wazinthu. Kafukufuku wokhudza njira ndi zida za semiconductor ndiye gwero lalikulu loyendetsa patsogolo msika ndikutsimikizira kutukuka kwa mafakitale ndi kupanga zinthu zambiri za semiconductor.
Mbiri yachitukuko chaukadaulo wonyamula ma semiconductor ndi mbiri yakusintha kosalekeza kwa magwiridwe antchito a chip ndi miniaturization mosalekeza. Mphamvu yoyendetsa mkati mwaukadaulo wonyamula katundu yasintha kuchokera kumagulu a mafoni apamwamba kupita kuzinthu monga makompyuta ochita bwino kwambiri komanso luntha lochita kupanga. Magawo anayi akukula kwaukadaulo wamapaketi a semiconductor akuwonetsedwa mu Gulu 1.
Pamene ma semiconductor lithography process node akupita ku 10 nm, 7 nm, 5 nm, 3 nm, ndi 2 nm, R&D ndi mtengo wopanga zikupitilira kukwera, kuchuluka kwa zokolola kumachepa, ndipo Lamulo la Moore limachepa. Malinga ndi zomwe zikuchitika m'mafakitale, zomwe zikutsatiridwa ndi kuchuluka kwa kachulukidwe ka transistor komanso kukwera kwakukulu kwamitengo yopangira zinthu, kulongedza kukukula molunjika ku miniaturization, kachulukidwe, magwiridwe antchito, kuthamanga kwambiri, ma frequency apamwamba, komanso kuphatikiza kwakukulu. Makampani opanga ma semiconductor alowa m'nthawi ya Moore, ndipo njira zotsogola sizingoyang'ananso kupititsa patsogolo ukadaulo waukadaulo wopanga mawafa, koma pang'onopang'ono kutembenukira kuukadaulo wapamwamba wazonyamula. Ukadaulo wotsogola wotsogola sungathe kusintha magwiridwe antchito ndikuwonjezera mtengo wazinthu, komanso kuchepetsa mtengo wopanga, kukhala njira yofunikira yopitirizira Chilamulo cha Moore. Kumbali imodzi, ukadaulo wa tinthu tating'ono umagwiritsidwa ntchito kugawa machitidwe ovuta kukhala maukadaulo angapo opaka omwe amatha kupakidwa mosiyanasiyana komanso mosiyanasiyana. Kumbali inayi, teknoloji yophatikizika yophatikizika imagwiritsidwa ntchito kuphatikizira zida zamitundu yosiyanasiyana ndi mapangidwe, omwe ali ndi mwayi wapadera wogwira ntchito. Kuphatikizika kwa ntchito zingapo ndi zida zazinthu zosiyanasiyana kumachitika pogwiritsa ntchito ukadaulo wa microelectronics, ndipo chitukuko kuchokera kumayendedwe ophatikizika kupita ku machitidwe ophatikizika amakwaniritsidwa.
Kupaka kwa semiconductor ndiye poyambira kupanga chip ndi mlatho pakati pa dziko lamkati la chip ndi dongosolo lakunja. Pakalipano, kuwonjezera pamakampani opanga ma semiconductor onyamula ndi kuyesa, semiconductormtandazoyambira, makampani opanga ma semiconductor, ndi makampani ophatikizika amagawo akupanga mwachangu ma CD apamwamba kapena matekinoloje ophatikizira ofunikira.
Waukulu njira zamakono ma CD luso ndimtandakupatulira, kudula, kufa kugwirizana, waya kugwirizana, kusindikiza pulasitiki, electroplating, kudula nthiti ndi akamaumba, etc. Pakati pawo, kufa kugwirizana ndondomeko ndi imodzi mwa zovuta kwambiri ndi zovuta ma CD ndondomeko, ndi kufa kugwirizana ndondomeko zida ndi imodzi mwa zida zofunika kwambiri pakuyika kwa semiconductor, ndipo ndi chimodzi mwa zida zopakira zomwe zili ndi mtengo wapamwamba kwambiri wamsika. Ngakhale ukadaulo wapamwamba wolongedza umagwiritsa ntchito njira zakutsogolo monga lithography, etching, metallization, ndi planarization, njira yofunikira kwambiri yokhazikitsira ikadali njira yolumikizira kufa.
2 Semiconductor die bonding process
2.1 Mwachidule
Njira yolumikizira kufa imatchedwanso chip loading, core loading, die bonding, chip bonding process, etc. Njira yogwirizanitsa kufa ikuwonetsedwa mu Chithunzi 1. Kawirikawiri, kufa kugwirizana ndiko kunyamula chip kuchokera ku chowotcha pogwiritsa ntchito mutu wowotcherera. Nozzle woyamwa pogwiritsa ntchito vacuum, ndikuyiyika pamalo osankhidwa a chimango chotsogolera kapena gawo lapansi loyika pansi motsogozedwa ndi mawonekedwe, kuti chip ndi pad zigwirizane. okhazikika. Ubwino ndi kuthekera kwa njira yolumikizirana ndi kufa kumakhudza mwachindunji ubwino ndi magwiridwe antchito a waya wotsatira, chifukwa chake kulumikizana ndi kufa ndi imodzi mwamaukadaulo ofunikira mu semiconductor back-end process.
Pazinthu zosiyanasiyana zopangira zida za semiconductor, pali njira zisanu ndi imodzi zazikuluzikulu zopangira ma die bonding, zomwe ndi zomatira, zomangira za eutectic, zomangira zofewa, zomangira zasiliva, zomangira zotentha, ndi ma flip-chip bonding. Kuti tikwaniritse kulumikizana kwa chip, ndikofunikira kupanga zinthu zofunika kwambiri munjira yolumikizirana kufa kuti zigwirizane, makamaka kuphatikiza zida zomangira zakufa, kutentha, nthawi, kukakamiza ndi zinthu zina.
2. 2 Njira yolumikizira zomatira
Pa zomatira zomata, kuchuluka kwa zomatira kumafunika kuyikidwa pa chimango chotsogolera kapena gawo lapansi la phukusi musanayike chip, ndiyeno mutu womangira wakufa umatenga chip, ndipo kudzera muupangiri wa masomphenya a makina, chip chimayikidwa molondola pa chomangiracho. udindo wa chimango kutsogolera kapena phukusi gawo lapansi wokutidwa ndi zomatira, ndi zina kufa n'zogwirizana mphamvu umagwiritsidwa ntchito kwa Chip kupyolera kufa kugwirizana mutu makina, kupanga zomatira wosanjikiza pakati chip ndi chimango chotsogolera kapena gawo lapansi la phukusi, kuti mukwaniritse cholinga chomangirira, kukhazikitsa ndi kukonza chip. Njira yolumikizira kufayi imatchedwanso glue bonding process chifukwa zomatira zimafunika kuyikidwa kutsogolo kwa makina omangira.
Zomatira zomwe zimagwiritsidwa ntchito nthawi zambiri zimaphatikizapo zida za semiconductor monga epoxy resin ndi phala la siliva la conductive. Kulumikiza zomatira ndi njira yomwe imagwiritsidwa ntchito kwambiri pa semiconductor chip die bonding chifukwa njira yake ndi yosavuta, mtengo wake ndi wotsika, komanso zida zosiyanasiyana zingagwiritsidwe ntchito.
2.3 Njira yolumikizirana ndi Eutectic
Panthawi yolumikizana ndi eutectic, zinthu zomangira za eutectic nthawi zambiri zimayikidwa pansi pa chip kapena chimango chotsogolera. Zida zomangira eutectic zimanyamula chip ndipo zimatsogozedwa ndi makina owonera makina kuti aziyika bwino chip pamalo olumikizirana a chimango chotsogolera. Chip ndi chimango chotsogolera zimapanga mawonekedwe olumikizirana eutectic pakati pa chip ndi gawo lapansi la phukusi pansi pa kuphatikiza kutentha ndi kukakamizidwa. Njira yolumikizirana eutectic nthawi zambiri imagwiritsidwa ntchito mu lead frame ndi ceramic substrate ma CD.
Zida zomangira eutectic nthawi zambiri zimasakanizidwa ndi zinthu ziwiri pa kutentha kwina. Zomwe zimagwiritsidwa ntchito nthawi zambiri zimaphatikizapo golidi ndi malata, golidi ndi silicon, ndi zina zotero. Mukamagwiritsa ntchito njira yolumikizira eutectic, gawo lotumizira njanji komwe chimango chotsogolera chilipo chidzawotchera chimango. Chinsinsi cha kukwaniritsidwa kwa njira yolumikizirana eutectic ndikuti zinthu zomangira eutectic zimatha kusungunuka pa kutentha pang'ono pansi pa malo osungunuka azinthu ziwirizi kuti apange chomangira. Pofuna kuteteza chimango kukhala oxidized panthawi ya mgwirizano wa eutectic, ndondomeko yogwirizanitsa eutectic imagwiritsanso ntchito mpweya wotetezera monga hydrogen ndi mpweya wosakanikirana wa nayitrogeni kuti ulowe mu njanji kuti uteteze chimango chotsogolera.
2. 4 Soft solder kugwirizana ndondomeko
Mukalumikiza solder yofewa, musanayike chip, malo omangirira pa chimango chotsogolera amamangidwa ndi kukanikizidwa, kapena amakanidwa pawiri, ndipo chimango chotsogolera chiyenera kutenthedwa munjirayo. Ubwino wa zofewa solder chomangira ndondomeko ndi wabwino matenthedwe madutsidwe, ndi kuipa kuti n'zosavuta oxidize ndi ndondomeko ndi zovuta. Ndiwoyenera kulongedza chimango chotsogolera cha zida zamagetsi, monga ma CD a transistor.
2. 5 Silver sintering kugwirizana ndondomeko
Njira yodalirika kwambiri yolumikizira chipangizo chamakono chachitatu champhamvu cha semiconductor chip ndikugwiritsa ntchito ukadaulo wazitsulo wachitsulo, womwe umasakaniza ma polima monga epoxy resin omwe amalumikizana ndi guluu conductive. Ili ndi ma conductivity abwino kwambiri amagetsi, matenthedwe amafuta, komanso mawonekedwe amtundu wotentha kwambiri. Ilinso ukadaulo wofunikira kuti pakhale zotsogola pakupakira kwa m'badwo wachitatu wa semiconductor m'zaka zaposachedwa.
2.6 Njira yolumikizira ya Thermocompression
Pakuyika kwa mabwalo ophatikizika apamwamba kwambiri amitundu itatu, chifukwa cha kuchepa kosalekeza kwa chip interconnect input/output pitch, bump size and phula, kampani ya Intel semiconductor yakhazikitsa njira yomangira thermocompression yopangira mapulogalamu ang'onoang'ono omangirira, kulumikizana pang'ono. tchipisi tokhala ndi phula la 40 mpaka 50 μm kapena ngakhale 10 μm. Thermocompression bonding process ndi yoyenera kugwiritsa ntchito chip-to-wafer ndi chip-to-substrate. Monga njira yachangu yamasitepe ambiri, njira yolumikizira thermocompression imakumana ndi zovuta pakuwongolera njira, monga kutentha kosagwirizana ndi kusungunuka kosalamulirika kwa solder yaying'ono. Panthawi yolumikizana ndi thermocompression, kutentha, kuthamanga, malo, ndi zina zotere ziyenera kukwaniritsa zofunikira zowongolera.
2.7 Njira yolumikizira chip chip
Mfundo yolumikizira chip chip ikuwonetsedwa mu Chithunzi 2. Makina opindika amanyamula chip kuchokera muwafa ndikuchizunguza 180 ° kuti asamutse chip. Mphuno yamutu wa soldering imanyamula chip kuchokera pa flip makina, ndipo kulowera kwa chip kumakhala pansi. Pambuyo kuwotcherera mutu nozzle kusuntha pamwamba pa ma CD gawo lapansi, izo zimayenda pansi kuti chomangira ndi kukonza Chip pa ma CD gawo lapansi.
Flip chip packaging ndiukadaulo wapamwamba wolumikizira chip ndipo wakhala njira yayikulu yopangira ukadaulo wapamwamba wonyamula. Ili ndi mawonekedwe a kachulukidwe kakang'ono, magwiridwe antchito apamwamba, owonda komanso amfupi, ndipo imatha kukwaniritsa zofunikira pakukula kwa zinthu zamagetsi zamagetsi monga mafoni am'manja ndi mapiritsi. Njira yolumikizira chip chip imapangitsa kuti mtengo wake ukhale wotsika kwambiri ndipo umatha kuzindikira tchipisi tambirimbiri komanso kulongedza kwa mbali zitatu. Imagwiritsidwa ntchito kwambiri m'magawo aukadaulo onyamula monga 2.5D/3D Integrated package, wafer-level ma CD, ndi ma CD a dongosolo. Njira yolumikizira chip chip ndiyomwe imagwiritsidwa ntchito kwambiri komanso yogwiritsidwa ntchito kwambiri paukadaulo wonyamula katundu wapamwamba kwambiri.
Nthawi yotumiza: Nov-18-2024