Kutsogolo kwa Mzere (FEOL): Kuyika Maziko

Kutsogolo, pakati ndi kumbuyo kumapeto kwa mizere yopanga semiconductor

Njira yopangira semiconductor imatha kugawidwa m'magawo atatu:
1) Kutsogolo kwa mzere
2) Pakatikati pa mzere
3) Kumbuyo kumapeto kwa mzere

Titha kugwiritsa ntchito fanizo losavuta monga kumanga nyumba kuti tifufuze zovuta zopanga chip:

Kutsogolo kwa mzere wopanga kuli ngati kuyika maziko ndikumanga makoma a nyumba. Popanga semiconductor, gawoli limaphatikizapo kupanga zoyambira ndi ma transistors pa chowotcha cha silicon.

Njira zazikulu za FEOL:

1.Kuyeretsa: Yambani ndi kachitsulo kakang'ono ka silicon ndikutsuka kuti muchotse zonyansa zilizonse.
2.Oxidation: Kulitsani gawo la silicon dioxide pawafa kuti mulekanitse magawo osiyanasiyana a chip.
3.Photolithography: Gwiritsani ntchito fotolithography kuti muyike mapatani pawafa, mofanana ndi kujambula mapulani ndi kuwala.
4.Etching: Etch kutali zapathengo pakachitsulo woipa kuwulula mapatani ankafuna.
5.Doping: Yambitsani zonyansa mu silicon kuti musinthe mphamvu zake zamagetsi, kupanga ma transistors, zomangira zomangira za chip chilichonse.

Mapeto a Mzere (MEOL): Kulumikiza Madontho

Mapeto apakati a mzere wopanga ali ngati kukhazikitsa mawaya ndi mapaipi m'nyumba. Gawoli likuyang'ana pa kukhazikitsa kulumikizana pakati pa ma transistors opangidwa mu gawo la FEOL.

Njira zazikulu za MEOL:

1.Dielectric Deposition: Deposit insulating layers (otchedwa dielectrics) kuteteza ma transistors.
2.Contact Formation: Fomu yolumikizirana kuti mulumikizane ndi ma transistors kwa wina ndi mnzake komanso kunja.
3.Interconnect: Onjezani zigawo zachitsulo kuti mupange njira zowonetsera magetsi, zofanana ndi waya wa nyumba kuti muwonetsetse kuti mphamvu zopanda malire ndi kuyenda kwa deta.

Kumapeto Kwa Mzere (BEOL): Kumaliza Kukhudza

Kumapeto kwa mzere wopanga kuli ngati kuwonjezera kukhudza komaliza kwa nyumba - kukhazikitsa zomangira, kujambula, ndikuwonetsetsa kuti zonse zikuyenda. Popanga ma semiconductor, gawo ili limaphatikizapo kuwonjezera zigawo zomaliza ndikukonzekera chip kuti anyamuke.

Njira zazikulu za BEOL:

1. Zowonjezera Zitsulo Zazitsulo: Onjezerani zigawo zingapo zazitsulo kuti muwonjezere kugwirizanitsa, kuonetsetsa kuti chip chikhoza kugwira ntchito zovuta komanso kuthamanga kwambiri.
2.Passivation: Ikani zigawo zoteteza kuti muteteze chip ku kuwonongeka kwa chilengedwe.
3.Kuyesa: Lembani chip ku kuyezetsa kolimba kuti muwonetsetse kuti ikukwaniritsa zofunikira zonse.
4.Dicing: Dulani chophikacho kukhala tchipisi tating'ono, iliyonse yokonzekera kulongedza ndikugwiritsa ntchito pazida zamagetsi.

Semicera ndi wotsogola wopanga OEM ku China, wodzipereka kuti apereke phindu lapadera kwa makasitomala athu. Timapereka zinthu zambiri zapamwamba ndi ntchito, kuphatikiza:

1.Kupaka kwa CVD SiC(Epitaxy, zida zokutidwa ndi CVD, zokutira zogwira ntchito kwambiri pazogwiritsa ntchito semiconductor, ndi zina)
2.CVD SiC Bulk Part(mphete za Etch, mphete zowunikira, zida za SiC za zida za semiconductor, ndi zina)
3.CVD TaC Coated Parts(Epitaxy, kukula kwa SiC wafer, ntchito zotentha kwambiri, ndi zina zambiri)
4.Zigawo za Graphite(Mabwato a graphite, zida za graphite zopangira kutentha kwambiri, ndi zina)
5.Zithunzi za SiC(Mabwato a SiC, machubu a ng'anjo a SiC, zida za SiC zopangira zida zapamwamba, ndi zina zambiri)
6.Zigawo za Quartz(Mabwato a quartz, magawo a quartz amtundu wa semiconductor ndi mafakitale a solar, ndi zina)

Kudzipereka kwathu pakuchita bwino kumatsimikizira kuti timapereka mayankho aukadaulo komanso odalirika pamafakitale osiyanasiyana, kuphatikiza kupanga ma semiconductor, kukonza zida zapamwamba, komanso kugwiritsa ntchito mwaukadaulo wapamwamba. Poyang'ana kulondola ndi khalidwe, tadzipereka kuti tikwaniritse zosowa zapadera za kasitomala aliyense.