Njira zamakono zopangira zida za semiconductor zikupita patsogolo pang'onopang'ono, koma momwe zida zodziwikiratu ndi matekinoloje amagwiritsidwira ntchito muzopaka za semiconductor zimatsimikizira kukwaniritsidwa kwa zotsatira zomwe zikuyembekezeka.Njira zopakira zomwe zilipo kale za semiconductor zimakhalabe ndi vuto locheperako, ndipo akatswiri amabizinesi sanagwiritse ntchito mokwanira zida zonyamula.Chifukwa chake, njira zopangira ma semiconductor omwe alibe chithandizo kuchokera kuukadaulo wowongolera makina azidzabweretsa ndalama zambiri zogwirira ntchito komanso nthawi, zomwe zimapangitsa kuti zikhale zovuta kwa akatswiri kuwongolera mosamalitsa mtundu wa ma semiconductor.
Chimodzi mwazinthu zofunika kuzisanthula ndizomwe zimakhudzidwa ndi kulongedza zinthu pa kudalirika kwa zinthu zotsika k.Kukhulupirika kwa mawonekedwe a waya wa golide ndi aluminiyamu kumakhudzidwa ndi zinthu monga nthawi ndi kutentha, zomwe zimapangitsa kudalirika kwake kuchepa pakapita nthawi ndipo kumabweretsa kusintha kwa gawo lake la mankhwala, zomwe zingayambitse delamination mu ndondomekoyi .Chifukwa chake, ndikofunikira kuyang'anira kuwongolera bwino pagawo lililonse la ndondomekoyi.Kupanga magulu apadera pa ntchito iliyonse kungathandize kuthana ndi mavutowa mosamala.Kumvetsetsa zomwe zimayambitsa mavuto omwe anthu ambiri amakumana nawo ndikukhazikitsa njira zodalirika, zodalirika ndizofunikira kuti pakhale njira yabwino.Makamaka, mikhalidwe yoyambirira ya mawaya omangirira, kuphatikiza zomangira zomangira ndi zida zapansi ndi zomangira, ziyenera kufufuzidwa mosamala.Malo omangirira ayenera kukhala oyera, ndipo kusankha ndi kugwiritsa ntchito zida zomangira ma waya, zida zomangira, ndi magawo omangirira ziyenera kukwaniritsa zofunikira pamlingo waukulu.Ndikoyenera kuphatikizira ukadaulo wa k copper process ndi kulumikizana bwino kuti muwonetsetse kuti mphamvu ya golide-aluminium IMC pa kudalirika kwapaketi ikuwonekera kwambiri.Kwa mawaya omangirira bwino, kupindika kulikonse kumatha kukhudza kukula kwa mipira yolumikizira ndikuletsa dera la IMC.Chifukwa chake, kuwongolera bwino kwambiri pamlingo wothandiza ndikofunikira, ndi magulu ndi ogwira nawo ntchito akuwunika bwino ntchito zawo ndi maudindo awo, kutsatira zofunikira ndi machitidwe kuti athetse zovuta zambiri.
Kukhazikitsa kwathunthu kwa phukusi la semiconductor kuli ndi chikhalidwe chaukadaulo.Akatswiri amakampani amayenera kutsatira mosamalitsa njira zopangira ma semiconductor kuti azigwira bwino zigawozo.Komabe, ogwira ntchito m'mabizinesi ena sagwiritsa ntchito njira zofananira kuti amalize kuyika kwa semiconductor komanso kunyalanyaza kutsimikizira zomwe zidapangidwa ndi zida za semiconductor.Zotsatira zake, zigawo zina za semiconductor zimayikidwa molakwika, zomwe zimalepheretsa semiconductor kugwira ntchito zake zoyambira komanso kukhudza phindu lazachuma la bizinesi.
Ponseponse, mulingo waukadaulo wamapangidwe a semiconductor ukufunikabe kuwongolera mwadongosolo.Akatswiri m'mabizinesi opanga ma semiconductor akuyenera kugwiritsa ntchito makina ojambulira otomatiki kuti awonetsetse kuti zida zonse za semiconductor zikusokonekera.Oyang'anira zabwino akuyenera kuwunika mozama komanso mosamalitsa kuti adziwe bwino zida za semiconductor zomwe zidasungidwa molakwika ndikulimbikitsa akatswiri kuti akonze zolondola.
Kuphatikiza apo, pankhani ya kuwongolera njira zama waya, kuyanjana pakati pa chitsulo chosanjikiza ndi gawo la ILD m'dera lolumikizira waya kumatha kupangitsa kuti pakhale delamination, makamaka ngati chingwe cholumikizira waya ndi chitsulo / ILD wosanjikiza chikusintha kukhala kapu. .Izi makamaka chifukwa cha kukakamizidwa ndi akupanga mphamvu yogwiritsidwa ntchito ndi makina opangira waya, omwe pang'onopang'ono amachepetsa mphamvu ya akupanga ndikutumiza kumalo opangira waya, kulepheretsa kufalikira kwa golide ndi maatomu a aluminium .Pachiyambi choyamba, kuwunika kwa ma waya otsika a k chip kumawonetsa kuti njira zolumikizirana ndizomvera kwambiri.Ngati zomangira zayikidwa zotsika kwambiri, nkhani ngati kuthyoka kwa waya ndi zomangira zofooka zitha kubuka.Kuchulukitsa akupanga mphamvu kubweza izi zingachititse mphamvu kutaya ndi kumawonjezera chikho woboola pakati mapindikidwe.Kuonjezera apo, kusakanikirana kofooka pakati pa ILD wosanjikiza ndi chitsulo chosanjikiza, pamodzi ndi brittleness ya zipangizo otsika k, ndi zifukwa zazikulu za delamination wa zitsulo wosanjikiza kuchokera ILD wosanjikiza.Zinthuzi ndi zina mwazovuta zazikulu pakuwongolera kwamakono kwa semiconductor packaging process and innovation.
Nthawi yotumiza: May-22-2024