Silicon carbide (SiC) single crystal chuma ali ndi gulu lalikulu kusiyana m'lifupi (~ Si 3 nthawi), mkulu matenthedwe madutsidwe (~Si 3.3 nthawi kapena GaAs 10 nthawi), mkulu ma elekitironi machulukitsidwe mlingo kusamuka (~Si 2.5 nthawi), mkulu kuwonongeka magetsi munda (~ Si 10 nthawi kapena GaAs 5 nthawi) ndi zina zabwino kwambiri.
Mphamvu za Semicera zimatha kupereka makasitomala apamwamba kwambiri (Conductive), Semi-insulating (Semi-insulating), HPSI (High Purity semi-insulating) silicon carbide substrate; Komanso, tikhoza kupereka makasitomala ndi homogeneous ndi heterogeneous pakachitsulo carbide epitaxial mapepala; Tikhozanso kusintha pepala la epitaxial malinga ndi zosowa zenizeni za makasitomala, ndipo palibe chiwerengero chochepa cha dongosolo.
Zinthu | Kupanga | Kafukufuku | Dummy |
Crystal Parameters | |||
Polytype | 4H | ||
Kulakwitsa koyang'ana pamwamba | <11-20>4±0.15° | ||
Magetsi Parameters | |||
Dopant | n-mtundu wa Nayitrogeni | ||
Kukaniza | 0.015-0.025ohm · masentimita | ||
Mechanical Parameters | |||
Diameter | 99.5-100mm | ||
Makulidwe | 350±25 μm | ||
Choyambira chapansi pamayendedwe | [1-100] ± 5° | ||
Kutalika kosalala koyambirira | 32.5 ± 1.5mm | ||
Sekondale lathyathyathya malo | 90 ° CW kuchokera ku lathyathyathya yoyamba ± 5 °. silicon pamwamba | ||
Sekondale lathyathyathya kutalika | 18 ± 1.5mm | ||
TTV | ≤5 μm | ≤10 μm | ≤20 μm |
LTV | ≤2 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | NA |
Kugwada | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
Warp | ≤20 μm | ≤45 μm | ≤50 μm |
Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
Kapangidwe | |||
Kuchuluka kwa Micropipe | ≤1 gawo/cm2 | ≤5 pa/cm2 | ≤10 pa/cm2 |
Zitsulo zonyansa | ≤5E10 maatomu/cm2 | NA | |
BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
TSD | ≤500 pa/cm2 | ≤1000 E/cm2 | NA |
Front Quality | |||
Patsogolo | Si | ||
Kumaliza pamwamba | Si-nkhope CMP | ||
Tinthu ting'onoting'ono | ≤60ea/wafer (kukula ≥0.3μm) | NA | |
Zokanda | ≤2ea/mm. Kutalika kwake ≤Diameter | Kutalika kokwanira≤2 * Diameter | NA |
Peel/maenje/madontho/mikwingwirima/ ming'alu/kuipitsidwa | Palibe | NA | |
M'mphepete tchipisi / indents / fracture / hex mbale | Palibe | NA | |
Magawo a polytype | Palibe | Malo owonjezera≤20% | Malo owonjezera ≤30% |
Chizindikiro cha laser chakutsogolo | Palibe | ||
Back Quality | |||
Kumbuyo komaliza | C-nkhope CMP | ||
Zokanda | ≤5ea/mm,Cumulative kutalika≤2*Diameter | NA | |
Zowonongeka zam'mbuyo (zolowera m'mphepete / ma indents) | Palibe | ||
Msana roughness | Ra≤0.2nm (5μm*5μm) | ||
Chizindikiro cha laser kumbuyo | 1 mm (kuchokera m'mphepete) | ||
M'mphepete | |||
M'mphepete | Chamfer | ||
Kupaka | |||
Kupaka | Chikwama chamkati chimadzazidwa ndi nayitrogeni ndipo thumba lakunja limapukutidwa. Multi-wafer cassette, epi-ready. | ||
*Zindikirani: "NA" zikutanthauza kuti palibe pempho Zinthu zomwe sizinatchulidwe zingatanthauze SEMI-STD. |