Ma Semicera's 4 Inch High Purity Semi-Insulating (HPSI) SiC Double-side Polished Wafer Substrates amapangidwa kuti akwaniritse zofunikira zamakampani opangira zida zamagetsi. Magawo awa adapangidwa mokhazikika komanso mwachiyero, omwe amapereka nsanja yabwino kwambiri pazida zamakono zamagetsi.
Izi zowotcha za HPSI SiC zimasiyanitsidwa ndi kupangika kwawo kwapamwamba kwamafuta komanso mphamvu zotchinjiriza zamagetsi, zomwe zimawapanga kukhala chisankho chabwino kwambiri pamagwiritsidwe apamwamba komanso amphamvu kwambiri. Kupukuta kwa mbali ziwiri kumatsimikizira kuuma pang'ono pamwamba, komwe kuli kofunikira kuti chipangizocho chizigwira ntchito komanso moyo wautali.
Kuyeretsedwa kwakukulu kwa zowotcha za Semicera's SiC kumachepetsa zolakwika ndi zonyansa, zomwe zimapangitsa kuti pakhale zokolola zambiri komanso kudalirika kwa chipangizocho. Magawo awa ndi oyenera kugwiritsidwa ntchito mosiyanasiyana, kuphatikiza zida za microwave, zamagetsi zamagetsi, ndi matekinoloje a LED, pomwe kulondola ndi kulimba ndikofunikira.
Poyang'ana zaukadaulo komanso mtundu, Semicera imagwiritsa ntchito njira zapamwamba zopangira kupanga zopangira zofewa zomwe zimakwaniritsa zofunikira zamagetsi amakono. Kupukuta kwa mbali ziwiri sikumangowonjezera mphamvu zamakina komanso kumathandizira kuphatikizana bwino ndi zida zina za semiconductor.
Posankha Semicera's 4 Inch High Purity Semi-Insulating HPSI SiC Double-side Polished Wafer Substrates, opanga atha kupezerapo mwayi pazabwino zowongolera matenthedwe ndi kutchinjiriza kwamagetsi, ndikutsegulira njira yopangira zida zamagetsi zogwira ntchito kwambiri komanso zamphamvu. Semicera ikupitirizabe kutsogolera makampaniwa ndi kudzipereka kwake ku chitukuko chabwino ndi zamakono.
| Zinthu | Kupanga | Kafukufuku | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Kulakwitsa koyang'ana pamwamba | <11-20>4±0.15° | ||
| Magetsi Parameters | |||
| Dopant | n-mtundu wa Nayitrogeni | ||
| Kukaniza | 0.015-0.025ohm · masentimita | ||
| Mechanical Parameters | |||
| Diameter | 150.0 ± 0.2mm | ||
| Makulidwe | 350±25 μm | ||
| Choyambira chapansi pamayendedwe | [1-100] ± 5° | ||
| Kutalika kosalala koyambirira | 47.5 ± 1.5mm | ||
| Sekondale flat | Palibe | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Kugwada | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Kapangidwe | |||
| Kuchuluka kwa Micropipe | <1 pa/cm2 | <10 pa/cm2 | <15 pa/cm2 |
| Zitsulo zonyansa | ≤5E10 maatomu/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 pa/cm2 | ≤1000 ea/cm2 | NA |
| Front Quality | |||
| Patsogolo | Si | ||
| Kumaliza pamwamba | Si-nkhope CMP | ||
| Tinthu ting'onoting'ono | ≤60ea/wafer (kukula ≥0.3μm) | NA | |
| Zikanda | ≤5ea/mm. Kutalika kwake ≤Diameter | Kutalika kokwanira≤2 * Diameter | NA |
| Peel/maenje/madontho/mikwingwirima/ ming'alu/kuipitsidwa | Palibe | NA | |
| M'mphepete tchipisi / indents / fracture / hex mbale | Palibe | ||
| Zigawo za polytype | Palibe | Malo owonjezera≤20% | Malo owonjezera ≤30% |
| Chizindikiro cha laser chakutsogolo | Palibe | ||
| Back Quality | |||
| Kumbuyo komaliza | C-nkhope CMP | ||
| Zikanda | ≤5ea/mm,Cumulative kutalika≤2*Diameter | NA | |
| Zowonongeka zam'mbuyo (zolowera m'mphepete / ma indents) | Palibe | ||
| Msana roughness | Ra≤0.2nm (5μm*5μm) | ||
| Chizindikiro cha laser kumbuyo | 1 mm (kuchokera m'mphepete) | ||
| M'mphepete | |||
| M'mphepete | Chamfer | ||
| Kupaka | |||
| Kupaka | Epi-okonzeka ndi zoyika vacuum Kupaka makaseti amitundu yambiri | ||
| *Zindikirani: "NA" zikutanthauza kuti palibe pempho Zinthu zomwe sizinatchulidwe zingatanthauze SEMI-STD. | |||
